Aehr Test Systems, Inc. offers test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form. Its products include the FOX-P family of test and burn-in systems and FOX WaferPak Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in and stabilize a range of devices such as silicon carbide-based and other power semiconductors, 2D and 3D sensors used in phones, tablets and other computing devices. FOX-CP system is a single-wafer compact test solution for logic, memory and photonic devices. FOX WaferPak Contactor contains a full wafer contactor capable of testing wafers up to 300 millimeters that enables integrated circuit manufacturers to perform testing, burn-in and stabilization of full wafers on the FOX-P systems. It offers packaged part reliability/burn-in test solutions.