MARKET

AEHR

AEHR

Aehr Test Sys
NASDAQ

Real-time Quotes | Nasdaq Last Sale

1.570
+0.080
+5.37%
After Hours: 1.510 -0.06 -3.82% 16:00 03/27 EDT
OPEN
1.460
PREV CLOSE
1.490
HIGH
1.680
LOW
1.300
VOLUME
90.84K
TURNOVER
--
52 WEEK HIGH
2.780
52 WEEK LOW
1.100
MARKET CAP
35.98M
P/E (TTM)
-10.8351
1D
5D
1M
3M
1Y
5Y

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Analyst Rating

Based on 1 analysts

Buy

Disclaimer: The analysis information is for reference only and does not constitute an investment recommendation.

Analyst Price Target

The average AEHR stock price target is 3.000 with a high estimate of 3.000 and a low estimate of 3.000.

EPS

AEHR News

More
  • Aehr Comments on COVID-19 and Measures to Operate at Near Full Capacity as Global Supplier to Critical Infrastructure Customers
  • GlobeNewswire · 19h ago
  • Aehr Test Systems to Announce Third Quarter Fiscal 2020 Financial Results on April 2, 2020
  • GlobeNewswire · 3d ago
  • Aehr to Showcase its FOX-P Wafer-Level and Module Test Solutions for Laser Stability at OFC 2020 in San Diego
  • GlobeNewswire · 03/09 21:05
  • Aehr Receives Over $2.9 Million in Orders for WaferPak Contactor and DiePak® Carrier Consumables for FOX Test & Burn-in System Installed Base
  • GlobeNewswire · 03/09 12:30

Industry

Semiconductor Equipment & Testing
-7.55%
Semiconductors & Semiconductor Equipment
-4.39%

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About AEHR

Aehr Test Systems is engaged in the designing, manufacturing and marketing of advanced test and burn-in products to the semiconductor manufacturing industry. The Company manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers and related accessories. The Company's principal products are the Advanced Burn-In and Test System (ABTS), the FOX full wafer contact parallel test and burn-in systems, WaferPak full wafer contactor, the DiePak carrier and test fixtures. The Company develops, manufactures and sells systems, which are designed to reduce the cost of testing and to perform reliability screening, or burn-in, of complex logic devices, memory integrated circuits (ICs), sensors and optical devices. These systems can be used to perform parallel testing and burn-in of packaged ICs, singulated bare die or ICs still in wafer form.
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