MARKET

ASYS

ASYS

Amtech Systems
NASDAQ
4.870
0.00
0.00%
Opening 09:30 04/25 EDT
OPEN
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PREV CLOSE
4.760
HIGH
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LOW
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VOLUME
0
TURNOVER
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52 WEEK HIGH
11.98
52 WEEK LOW
3.370
MARKET CAP
69.11M
P/E (TTM)
-3.5954
1D
5D
1M
3M
1Y
5Y
Press Release: Amtech Systems to Announce Second Quarter 2024 Financial Results on Wednesday, May 8, 2024
Amtech Systems to announce its second quarter 2024 financial results for the period ended March 31, 2024, on Wednesday, May 8, 2024. The company will host a conference call to discuss these results. Amtech is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing equipment.
Dow Jones · 17h ago
Weekly Report: what happened at ASYS last week (0415-0419)?
Weekly Report · 3d ago
Weekly Report: what happened at ASYS last week (0408-0412)?
Weekly Report · 04/15 09:20
Weekly Report: what happened at ASYS last week (0401-0405)?
Weekly Report · 04/08 09:21
Weekly Report: what happened at ASYS last week (0325-0329)?
Weekly Report · 04/01 09:21
Weekly Report: what happened at ASYS last week (0318-0322)?
Weekly Report · 03/25 09:21
Does Amtech Systems (NASDAQ:ASYS) Have A Healthy Balance Sheet?
Amtech Systems, Inc. (NASDAQ:ASYS) has US$10.0m of debt. The company uses debt to fund its operations. Amtech Systems has a negative free cash flow of US$3.7m in the last year. Despite this, the company does not have a heavy debt load. The balance sheet is a good indicator of a company's ability to maintain a healthy balance sheet. We've discovered 3 warning signs for Amtech systems that you should be aware of.
Simply Wall St · 03/22 11:59
Weekly Report: what happened at ASYS last week (0311-0315)?
Weekly Report · 03/18 09:21
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About ASYS
Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.

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