News
BESIY
332.36
-0.79%
-2.64
Weekly Report: what happened at BESIY last week (0601-0605)?
Weekly Report · 2d ago
Weekly Report: what happened at BESIY last week (0525-0529)?
Weekly Report · 06/01 09:04
Weekly Report: what happened at BESIY last week (0518-0522)?
Weekly Report · 05/25 09:04
BE Semiconductor price target raised to EUR 300 from EUR 200 at Morgan Stanley
TipRanks · 05/19 16:25
Morgan Stanley Sticks to Their Buy Rating for BE Semiconductor (0XVE)
TipRanks · 05/19 12:36
Weekly Report: what happened at BESIY last week (0511-0515)?
Weekly Report · 05/18 09:04
BE Semiconductor (0XVE) Gets a Buy from Bernstein
TipRanks · 05/11 11:59
Weekly Report: what happened at BESIY last week (0504-0508)?
Weekly Report · 05/11 09:04
Weekly Report: what happened at BESIY last week (0427-0501)?
Weekly Report · 05/04 09:04
Kepler Capital Sticks to Their Hold Rating for BE Semiconductor (0XVE)
TipRanks · 04/30 02:09
BE Semiconductor Rides Hybrid Bonding Wave in Earnings
TipRanks · 04/28 00:11
BE Semiconductor price target raised to EUR 266 from EUR 230 at JPMorgan
TipRanks · 04/27 19:26
Weekly Report: what happened at BESIY last week (0420-0424)?
Weekly Report · 04/27 09:04
Goldman Sachs Sticks to Their Buy Rating for BE Semiconductor (0XVE)
TipRanks · 04/27 06:53
BE Semiconductor (0XVE) Receives a Hold from Berenberg Bank
TipRanks · 04/27 06:35
Kepler Capital Reaffirms Their Hold Rating on BE Semiconductor (0XVE)
TipRanks · 04/25 01:51
Citi Sticks to Its Hold Rating for BE Semiconductor (0XVE)
TipRanks · 04/24 06:48
Barclays Sticks to Their Hold Rating for BE Semiconductor (0XVE)
TipRanks · 04/24 06:47
BE Semiconductor GAAP EPS of €0.65, revenue of €184.9M; gives Q2 outlook
Seeking Alpha · 04/23 05:48
BE Semiconductor Industries N.V. Announces Q1-26 Results
Barchart · 04/23 01:19
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About BESIY
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.