News
KLIC
41.62
+3.08%
1.25
Ex-Dividend Reminder: Hewlett Packard Enterprise, Broadcom and Kulicke & Soffa Industries
NASDAQ · 51m ago
Weekly Report: what happened at KLIC last week (0909-0913)?
Weekly Report · 1d ago
Ex-Dividend Date Nearing for These 10 Stocks – Week of September 16, 2024
NASDAQ · 2d ago
Kulicke And Soffa Industries Has Broken Below Multi-Year Support
Seeking Alpha · 09/10 10:04
Weekly Report: what happened at KLIC last week (0902-0906)?
Weekly Report · 09/09 09:27
Validea's Top Information Technology Stocks Based On Benjamin Graham - 9/4/2024
NASDAQ · 09/04 15:00
Unpacking Q2 Earnings: Amkor (NASDAQ:AMKR) In The Context Of Other Semiconductor Manufacturing Stocks
Barchart · 09/03 06:06
Weekly Report: what happened at KLIC last week (0826-0830)?
Weekly Report · 09/02 09:29
Kulicke & Soffa Declares Quarterly Dividend, Rewards Shareholders
TipRanks · 08/26 13:28
Kulicke and Soffa declares $0.20 dividend
Seeking Alpha · 08/26 13:14
Press Release: Kulicke & Soffa Declares Quarterly Dividend of $0.20
Dow Jones · 08/26 13:05
Weekly Report: what happened at KLIC last week (0819-0823)?
Weekly Report · 08/26 09:28
Kulicke & Soffa Declares Quarterly Dividend of $0.20
Barchart · 08/26 08:05
Weekly Report: what happened at KLIC last week (0812-0816)?
Weekly Report · 08/19 09:26
Weekly Report: what happened at KLIC last week (0805-0809)?
Weekly Report · 08/12 09:26
Kulicke & Soffa Is Maintained at Hold by TD Cowen
Dow Jones · 08/08 18:34
Kulicke & Soffa Price Target Cut to $45.00/Share From $52.00 by TD Cowen
Dow Jones · 08/08 18:34
TD Cowen Maintains Hold on Kulicke & Soffa Indus, Lowers Price Target to $45
Benzinga · 08/08 18:25
Kulicke & Soffa Is Maintained at Buy by Craig-Hallum
Dow Jones · 08/08 16:12
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About KLIC
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in designs, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge bonding equipment. The Company's Advanced Solutions is in design, development, manufacture, and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in the design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.