News
KLIC
104.40
+3.27%
3.31
K&S director Yeo Mui Sung disposes 20,000 shares for $2 million
PUBT · 1d ago
Entegris and Kulicke and Soffa Shares Plummet, What You Need To Know
Barchart · 3d ago
Notable ETF Outflow Detected - FNDC, CSTM, KLIC, FRO
NASDAQ · 4d ago
Weekly Report: what happened at KLIC last week (0511-0515)?
Weekly Report · 5d ago
Assessing Kulicke And Soffa (KLIC) Valuation After Earnings Rebound And Advanced Packaging Investment Plans
Simply Wall St · 5d ago
Teradyne, Kulicke and Soffa, Impinj, Microchip Technology, and IPG Photonics Shares Plummet, What You Need To Know
Barchart · 05/15 12:22
Why Kulicke and Soffa (KLIC) Is Up 6.1% After AI-Focused Thermo-Compression Capacity Expansion Plan
Simply Wall St · 05/14 23:42
Looking for under-the-radar value in the AI supply chain
Seeking Alpha · 05/13 13:16
K&S General Counsel Lim Zi Yao sells 1,500 shares for $154,463.1
PUBT · 05/13 00:05
Kulicke & Soffa Industries on Track for Record High Close -- Data Talk
Dow Jones · 05/11 19:30
Weekly Report: what happened at KLIC last week (0504-0508)?
Weekly Report · 05/11 09:34
Assessing Kulicke And Soffa (KLIC) Valuation After A Powerful Run In Shareholder Returns
Simply Wall St · 05/10 05:38
Kulicke & Soffa: Buy On The TCB Inflection
Seeking Alpha · 05/09 08:00
Kulicke And Soffa (KLIC) Q2 EPS Rebound Tests Bearish Earnings Volatility Narrative
Simply Wall St · 05/08 17:53
Kulicke & Soffa price target raised to $100 from $80 at B. Riley
TipRanks · 05/08 15:12
Kulicke & Soffa (KLIC) Receives a Rating Update from a Top Analyst
TipRanks · 05/08 13:25
Kulicke & Soffa Signals Confident Packaging Recovery
TipRanks · 05/08 00:53
Kulicke & Soffa Is Maintained at Buy by Needham
Dow Jones · 05/07 20:16
Kulicke & Soffa Price Target Raised to $105.00/Share From $70.00 by Needham
Dow Jones · 05/07 20:16
Needham Sticks to Their Buy Rating for Kulicke & Soffa (KLIC)
TipRanks · 05/07 20:15
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About KLIC
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and provides services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays, and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in design, development, manufacture, and selling ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge-related bonding equipment. The Advanced Solutions segment is in design, development, manufacture and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment are in design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.