News
IMOS
59.32
+11.81%
6.27
ChipMOS Is Spending More Than Planned — AI And Memory Growth Are Why
Benzinga · 3h ago
Here are the major earnings after the close Tuesday
Seeking Alpha · 6h ago
12 Information Technology Stocks Moving In Tuesday's Pre-Market Session
Benzinga · 8h ago
At a glance: stocks gapping up premarket
Seeking Alpha · 9h ago
ChipMOS Board Approves Strong First-Half 2026 Financial Results
TipRanks · 9h ago
ChipMOS Delivers Highest Quarterly Revenue Since 2014 on Strong 2Q 2026 Turnaround
TipRanks · 9h ago
ChipMOS reports Q2 EPS 80c vs. 47c last year
TipRanks · 10h ago
ChipMOS GAAP EPADS of $0.80, revenue of $231.8M misses by $8.77M
Seeking Alpha · 11h ago
ChipMOS TECHNOLOGIES Q2 EPS $0.80 Up From $(0.51) YoY, Sales $231.800M Up From $196.600M YoY
Benzinga · 12h ago
ChipMOS REPORTS SECOND QUARTER 2026 RESULTS; RECORD HIGH QUARTERLY REVENUE SINCE 2014
PR Newswire · 12h ago
12 Information Technology Stocks Moving In Monday's Pre-Market Session
Benzinga · 1d ago
ChipMOS Sets Highest Monthly Revenue Since 2014 on Surging AI Demand in July 2026
TipRanks · 1d ago
ChipMOS Reports July Sales Of $87.5M, Up 43.6% Year-On-Year
Benzinga · 1d ago
ChipMOS July revenue hits record high, jumps ~44% Y/Y
Seeking Alpha · 1d ago
ChipMOS reports July revenue $87.5M, up 43.6%
TipRanks · 1d ago
ChipMOS REPORTS 43.6% YoY INCREASE IN JULY 2026 REVENUE; NEW RECORD HIIGH MONTHLY REVENUE LEVEL SINCE 2014
PR Newswire · 1d ago
Weekly Report: what happened at IMOS last week (0803-0807)?
Weekly Report · 1d ago
ChipMOS Sets August 11 Board Meeting to Approve Q2 2026 Financial Statements
TipRanks · 08/03 10:30
Weekly Report: what happened at IMOS last week (0727-0731)?
Weekly Report · 08/03 09:24
Meta Posts Mixed Q2 Results, Joins Coursera, Qualcomm And Other Big Stocks Moving Lower In Thursday’s Pre-Market Session
Benzinga · 07/30 12:03
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About IMOS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.