News
IMOS
60.54
+2.78%
1.64
AI data centers hit a new bottleneck: Optical interconnects
Seeking Alpha · 3d ago
ChipMOS Technologies Invests NT$512 Million in Plant Engineering and Equipment Upgrades
TipRanks · 4d ago
Weekly Report: what happened at IMOS last week (0615-0619)?
Weekly Report · 5d ago
12 Information Technology Stocks Moving In Thursday's Pre-Market Session
Benzinga · 06/18 12:06
Bandwidth, Traws Pharma And Other Big Stocks Moving Lower In Monday's Pre-Market Session
Benzinga · 06/15 12:01
Weekly Report: what happened at IMOS last week (0608-0612)?
Weekly Report · 06/15 09:28
Stitch Fix, Intel, KLA And Other Big Stocks Moving Higher On Thursday
Benzinga · 06/11 14:10
ChipMOS May Revenue Climbs 17.7% Year-on-Year on AI Demand
TipRanks · 06/10 10:28
ChipMOS reports May revenue $76M, up 17.7%
TipRanks · 06/10 10:07
ChipMOS Reports May Sales Of $76M, Up 17.7% YoY
Benzinga · 06/10 10:05
ChipMOS May revenue up nearly 18% Y/Y
Seeking Alpha · 06/10 10:05
ChipMOS REPORTS 17.7% YoY INCREASE IN MAY 2026 REVENUE
PR Newswire · 06/10 10:00
Weekly Report: what happened at IMOS last week (0601-0605)?
Weekly Report · 06/08 09:26
Weekly Report: what happened at IMOS last week (0525-0529)?
Weekly Report · 06/01 09:28
ChipMOS declares $0.78 dividend
Seeking Alpha · 05/27 12:24
ChipMOS Shareholders Approve Tax-Efficient Cash Dividend for 2026
TipRanks · 05/27 10:28
ChipMOS Shareholders Approve 2025 Results, Cash Payout and Director Non-Compete Waivers
TipRanks · 05/26 10:32
ChipMOS Sets Ex-Dividend and Payout Dates for 2026 Cash Dividend
TipRanks · 05/26 10:30
Weekly Report: what happened at IMOS last week (0518-0522)?
Weekly Report · 05/25 09:29
ChipMOS to Brief Investors at Cathay Securities Q2 Industry Forum on May 27
TipRanks · 05/20 10:44
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About IMOS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.