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IMOS
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Weekly Report: what happened at IMOS last week (0406-0410)?
Weekly Report · 22h ago
ChipMOS TECHNOLOGIES Sees Q1 Sales $216.400M
Benzinga · 3d ago
ChipMOS March and Q1 2026 Revenue Surge on AI-Driven Memory Demand
TipRanks · 3d ago
ChipMOS reports Q1 revenue $216.4M vs. $172.6M last year
TipRanks · 3d ago
ChipMOS Q1 revenue jumps 25.4% Y/Y; March sales surge 23.1%
Seeking Alpha · 3d ago
ChipMOS REPORTS 23.1% YoY INCREASE IN MARCH 2026 REVENUE; 25.4% YoY INCREASE IN 1Q26 REVENUE
PR Newswire · 3d ago
Weekly Report: what happened at IMOS last week (0330-0403)?
Weekly Report · 04/06 09:28
ChipMOS Invests NT$688.9 Million in New Semiconductor Manufacturing Equipment
TipRanks · 04/02 10:30
ChipMOS Technologies: AI Memory Tailwinds Offset By Serious Macro Risks
Seeking Alpha · 03/31 11:30
Weekly Report: what happened at IMOS last week (0323-0327)?
Weekly Report · 03/30 09:28
Weekly Report: what happened at IMOS last week (0316-0320)?
Weekly Report · 03/23 09:27
Weekly Report: what happened at IMOS last week (0309-0313)?
Weekly Report · 03/16 09:26
ChipMOS to Present at BofA Securities 2026 Asia Tech Conference
PR Newswire · 03/12 10:00
ChipMOS revenue drops 6.4% to $68.4M in February
Seeking Alpha · 03/10 11:29
ChipMOS reports February revenue $68.4M, up 22.1%
TipRanks · 03/10 11:00
ChipMOS Posts 22% Year-on-Year Revenue Jump in February 2026 on AI and Data Center Demand
TipRanks · 03/10 10:28
ChipMOS Approves NT$880 Million Tainan Facility Purchase to Bolster Production
TipRanks · 03/10 10:27
ChipMOS REPORTS 22.1% YoY INCREASE IN FEBRUARY 2026 REVENUE
PR Newswire · 03/10 10:00
Weekly Report: what happened at IMOS last week (0302-0306)?
Weekly Report · 03/09 09:27
ChipMOS Technologies Posts Strong Earnings Rebound as TWSE Triggers Financial Disclosure
TipRanks · 03/02 11:33
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About IMOS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.