News
IMOS
27.97
+0.72%
0.20
ChipMOS Completes Treasury Stock Cancellation
TipRanks · 5d ago
Weekly Report: what happened at IMOS last week (1124-1128)?
Weekly Report · 5d ago
Weekly Report: what happened at IMOS last week (1117-1121)?
Weekly Report · 11/24 09:28
Top 2 Tech Stocks That May Fall Off A Cliff This Month
Benzinga · 11/19 13:00
Weekly Report: what happened at IMOS last week (1110-1114)?
Weekly Report · 11/17 09:29
12 Information Technology Stocks Moving In Thursday's Intraday Session
Benzinga · 11/13 17:06
Morning News Wrap-Up: Wednesday’s Biggest Stock Market Stories!
TipRanks · 11/12 18:03
12 Information Technology Stocks Moving In Wednesday's Intraday Session
Benzinga · 11/12 17:05
Pharming Group Posts Upbeat Q3 Results, Joins On Holding, BigBear.ai Holdings And Other Big Stocks Moving Higher On Wednesday
Benzinga · 11/12 16:19
IMOS Earnings: ChipMOS Technologies Stock Soars on Strong Q3 Report
TipRanks · 11/12 13:36
12 Information Technology Stocks Moving In Wednesday's Pre-Market Session
Benzinga · 11/12 12:05
ChipMOS Announces Q3 2025 Financial Results and Share Capital Reduction
TipRanks · 11/12 11:38
ChipMOS Reports Strong Q3 2025 Financial Results
TipRanks · 11/12 11:34
What To Do After ChipMOS Reported Q4 Results
Seeking Alpha · 11/11 17:59
Morning Movers: Nvidia dips after SoftBank sells out of stake
TipRanks · 11/11 14:00
12 Information Technology Stocks Moving In Tuesday's Pre-Market Session
Benzinga · 11/11 12:07
Earnings Scheduled For November 11, 2025
Benzinga · 11/11 11:11
ChipMOS reports Q3 EPS 33c vs. 27c last year
TipRanks · 11/11 10:15
Chipmos October Revenue Increases 22% Y-O-Y
NASDAQ · 11/11 10:09
ChipMOS GAAP EPADS of $0.33, revenue of $201.7M beats by $5.23M
Seeking Alpha · 11/11 09:37
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About IMOS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.