On October 23, Baiwei Storage announced the recent production and operation situation, stating that the company's recent industry trends and production and operation conditions have received widespread attention from the market. Since 2026, prices of major storage products such as DRAM and NAND Flash have risen markedly due to factors such as the continuous advancement of artificial intelligence computing power infrastructure construction and the growth in storage demand from global data centers and cloud service vendors, and the industry's prosperity has increased. The company continues to promote the “storage+wafer-level advanced packaging and testing” dual-wheel drive strategy to accelerate the construction of wafer-level advanced packaging and testing manufacturing projects. The company continues to promote R&D and industrial application of advanced packaging technologies such as FOMS, CMC, and OEC, focusing on fields such as advanced storage, storage and computing, and high-speed optoelectronic interconnection, and is actively expanding emerging application markets such as artificial intelligence computing power infrastructure. The company is optimistic about the medium- to long-term storage market opportunities brought about by the development of the artificial intelligence industry, and will continue to take advantage of technology accumulation and industrial synergy in the fields of storage solutions, chip design and advanced packaging testing, and actively seize industry development opportunities.

On October 23, Baiwei Storage announced the recent production and operation situation, stating that the company's recent industry trends and production and operation conditions have received widespread attention from the market. Since 2026, prices of major storage products such as DRAM and NAND Flash have risen markedly due to factors such as the continuous advancement of artificial intelligence computing power infrastructure construction and the growth in storage demand from global data centers and cloud service vendors, and the industry's prosperity has increased. The company continues to promote the “storage+wafer-level advanced packaging and testing” dual-wheel drive strategy to accelerate the construction of wafer-level advanced packaging and testing manufacturing projects. The company continues to promote R&D and industrial application of advanced packaging technologies such as FOMS, CMC, and OEC, focusing on fields such as advanced storage, storage and computing, and high-speed optoelectronic interconnection, and is actively expanding emerging application markets such as artificial intelligence computing power infrastructure. The company is optimistic about the medium- to long-term storage market opportunities brought about by the development of the artificial intelligence industry, and will continue to take advantage of technology accumulation and industrial synergy in the fields of storage solutions, chip design and advanced packaging testing, and actively seize industry development opportunities.