Simplatform Secures KRW 1.93 Billion Government Grant for Semiconductor Packaging AI Project

PUBT · 2d ago
Simplatform Secures KRW 1.93 Billion Government Grant for Semiconductor Packaging AI Project
  • Simplatform secured KRW 1.93 billion in government funding for an AI transformation demonstration project focused on semiconductor packaging in Cheongju.
  • Chungbuk Technopark leads the project, which has total government funding of KRW 14 billion.
  • The project runs from Oct. 1, 2026, through Dec. 31, 2029.


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