UBS predicts that the HBM consumption of Google's TPU will reach 19.24 billion Gb in 2027, up 229% year-on-year from the 2026 estimate of 5.85 billion Gb. Demand for HBM corresponding to TPU has risen rapidly from 1.81 billion Gb in 2025 and is expected to reach 2.4048 million GB in 2027. Google's expansion in the scale of self-developed chips will take up the production capacity of exclusive memory wafers and push high-bandwidth memory procurement towards ASIC chips manufactured by cloud manufacturers. UBS estimates that in 2027, the TPU v8i dual-nude film AX will consume 1.152 million GB of HBM3E; the TPU v8t will consume 950,400 GB; and the TPU v7 will consume 288,000 GB. Total demand for the overall AI accelerator HBM surged 91% year over year, reaching 61.52 billion Gb. The core risk comes from the assembly capacity throughput of advanced packages; once TSMC's CoWoS package production capacity is limited, the system integration process will be delayed, and memory manufacturers will have excess inventory of finished HBM stacked chips.

Zhitongcaijing · 2d ago
UBS predicts that the HBM consumption of Google's TPU will reach 19.24 billion Gb in 2027, up 229% year-on-year from the 2026 estimate of 5.85 billion Gb. Demand for HBM corresponding to TPU has risen rapidly from 1.81 billion Gb in 2025 and is expected to reach 2.4048 million GB in 2027. Google's expansion in the scale of self-developed chips will take up the production capacity of exclusive memory wafers and push high-bandwidth memory procurement towards ASIC chips manufactured by cloud manufacturers. UBS estimates that in 2027, the TPU v8i dual-nude film AX will consume 1.152 million GB of HBM3E; the TPU v8t will consume 950,400 GB; and the TPU v7 will consume 288,000 GB. Total demand for the overall AI accelerator HBM surged 91% year over year, reaching 61.52 billion Gb. The core risk comes from the assembly capacity throughput of advanced packages; once TSMC's CoWoS package production capacity is limited, the system integration process will be delayed, and memory manufacturers will have excess inventory of finished HBM stacked chips.