Huang Yu, chief scientist of Huawei Semiconductors EDA, said today at the 2026 Bay Core Exhibition that Huawei's Tao Law is mainly divided into four layers: the most basic device layer, which optimizes the transistor structure and interconnection method, and compresses device time constants from the source; the second layer is the link layer, which is our biggest innovation point; the third layer is the chip layer, where software and hardware are co-designed to form a new architecture; and the fourth layer is the system layer, that is, the well-known supernode and cabinet interconnection, which requires better communication protocols and faster speed. It said, “The biggest challenge for Tao's law is the EDA tool. At the same time, there are process challenges, engineering challenges, and system design challenges.”

Huang Yu, chief scientist of Huawei Semiconductors EDA, said today at the 2026 Bay Core Exhibition that Huawei's Tao Law is mainly divided into four layers: the most basic device layer, which optimizes the transistor structure and interconnection method, and compresses device time constants from the source; the second layer is the link layer, which is our biggest innovation point; the third layer is the chip layer, where software and hardware are co-designed to form a new architecture; and the fourth layer is the system layer, that is, the well-known supernode and cabinet interconnection, which requires better communication protocols and faster speed. It said, “The biggest challenge for Tao's law is the EDA tool. At the same time, there are process challenges, engineering challenges, and system design challenges.”