On October 14, at the 2026 Wanchip Exhibition, China Micro introduced the two newly released high-end semiconductor microprocessing equipment — Primo XD-RIE™ extremely high aspect ratio etching equipment and Prefima Unicore™ AM 12-inch ALD molybdenum equipment. According to reports, China Micro will develop more than 20 new high-end thin film devices within five years to help the needs of 7 nm to 3 nm and more advanced logic devices, 300 to 500 layers and above, and more advanced memory devices.

On October 14, at the 2026 Wanchip Exhibition, China Micro introduced the two newly released high-end semiconductor microprocessing equipment — Primo XD-RIE™ extremely high aspect ratio etching equipment and Prefima Unicore™ AM 12-inch ALD molybdenum equipment. According to reports, China Micro will develop more than 20 new high-end thin film devices within five years to help the needs of 7 nm to 3 nm and more advanced logic devices, 300 to 500 layers and above, and more advanced memory devices.