At the 2026 Wanchip launch ceremony and semiconductor industry development summit held today, Cong Hai, senior vice president of CCW and general manager of the global business management department, plasma etching product headquarters, epitaxial product department and dielectric film product department, said that China Micro currently has 54 high-end equipment product lines, and the R&D cycle has been shortened from 3-5 years to less than 2 years, and more than 20 new devices are being developed every year. It revealed that in the past 3 to 5 years, Zhongwei will develop 102 new devices, with a total R&D investment of nearly 13 billion yuan. The equipment developed includes high-end equipment required for the front end of integrated circuits, equipment required for advanced packaging in the back end, and equipment required for the pan-semiconductor field. “In the next five to ten years, China, Micro and its partners will work together to cover 60% of the integrated circuit high-end equipment market.”

At the 2026 Wanchip launch ceremony and semiconductor industry development summit held today, Cong Hai, senior vice president of CCW and general manager of the global business management department, plasma etching product headquarters, epitaxial product department and dielectric film product department, said that China Micro currently has 54 high-end equipment product lines, and the R&D cycle has been shortened from 3-5 years to less than 2 years, and more than 20 new devices are being developed every year. It revealed that in the past 3 to 5 years, Zhongwei will develop 102 new devices, with a total R&D investment of nearly 13 billion yuan. The equipment developed includes high-end equipment required for the front end of integrated circuits, equipment required for advanced packaging in the back end, and equipment required for the pan-semiconductor field. “In the next five to ten years, China, Micro and its partners will work together to cover 60% of the integrated circuit high-end equipment market.”