Sanjia Technology said at the 2026 semi-annual results briefing held on October 13 that the company's R&D work related to fan-out wafer-level packaging is continuing. The product still has many difficulties to be solved before mass production and subsequent R&D, and there are uncertainties, which are mainly affected by uncertain technical factors and market factors.

Zhitongcaijing · 2d ago
Sanjia Technology said at the 2026 semi-annual results briefing held on October 13 that the company's R&D work related to fan-out wafer-level packaging is continuing. The product still has many difficulties to be solved before mass production and subsequent R&D, and there are uncertainties, which are mainly affected by uncertain technical factors and market factors.