On the evening of October 9, Dagang Co., Ltd. announced that the Beijing Xiaomi Smart Manufacturing Equity Investment Fund partnership and the Shanghai Semiconductor Materials Fund Phase II formed a consortium to compete for 16% of Suzhou Keyang Semiconductor Co., Ltd.'s shares with 200 million yuan, and the two sides plan to invest 100 million yuan each to transfer 8% of the shares. The transaction still needs to be reviewed by the shareholders' meeting and approved by the competent state-owned assets department. According to Tianyan Research, the invention patent for “an optoelectronic packaging structure and its packaging method” applied for by Suzhou Keyang was made public in June of this year and is currently in the substantive review stage. The company and Xi'an University of Electronic Science and Technology jointly applied for the “A Wafer-Level Acoustic Function Test Method and Support Substrate” invention patent, which was granted in July this year.

On the evening of October 9, Dagang Co., Ltd. announced that the Beijing Xiaomi Smart Manufacturing Equity Investment Fund partnership and the Shanghai Semiconductor Materials Fund Phase II formed a consortium to compete for 16% of Suzhou Keyang Semiconductor Co., Ltd.'s shares with 200 million yuan, and the two sides plan to invest 100 million yuan each to transfer 8% of the shares. The transaction still needs to be reviewed by the shareholders' meeting and approved by the competent state-owned assets department. According to Tianyan Research, the invention patent for “an optoelectronic packaging structure and its packaging method” applied for by Suzhou Keyang was made public in June of this year and is currently in the substantive review stage. The company and Xi'an University of Electronic Science and Technology jointly applied for the “A Wafer-Level Acoustic Function Test Method and Support Substrate” invention patent, which was granted in July this year.