Gapwaves showcases MLW-based waveguide packaging for compact high-power amplifier modules at EuMW 2026

PUBT · 2d ago
Gapwaves showcases MLW-based waveguide packaging for compact high-power amplifier modules at EuMW 2026
  • Gapwaves unveiled a compact, waveguide-packaged high-power amplifier module built with its patented Multi-Layer Waveguide technology.
  • The copper waveguide structure targets lower signal losses with improved heat dissipation, supporting higher output in space- and weight-constrained platforms.
  • Gotmic integrated its MMIC power amplifier directly into the waveguide, delivering a thin module aimed at W-band 92–100 GHz systems.
  • Uses include airborne radar, telecom backhaul, future 6G networks, satellite communications, where thermal management is a key design constraint.
  • Hardware will be shown at European Microwave Week in London on Oct. 6–8, 2026.


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