According to the Wuxi Daily, Changdian Technology's high-end advanced sealing and testing project was signed and launched in Wuxi on September 29. The project focuses on cutting-edge fields such as R&D and industrialization of 2.5D advanced packaging technology for silicon adapter boards, and serves high-value-added markets such as artificial intelligence and high-performance computing.

Zhitongcaijing · 3d ago
According to the Wuxi Daily, Changdian Technology's high-end advanced sealing and testing project was signed and launched in Wuxi on September 29. The project focuses on cutting-edge fields such as R&D and industrialization of 2.5D advanced packaging technology for silicon adapter boards, and serves high-value-added markets such as artificial intelligence and high-performance computing.