On September 30, Dongxin Co., Ltd. announced the Investor Relations Activity Record Form. The planning cycle for the company's integrated chip R&D project is about 42 months, and the project is progressing in an orderly manner. The project integrates storage, connectivity, and computing units into a single chip through advanced packaging to create a low-power embedded intelligent computing chip. It has the characteristics of local intelligent processing, data privacy and security, low latency, and low power consumption. The company's own team is responsible for research and development. Chips need to go through various stages such as architecture design, streaming, software and hardware debugging, and customer verification. There is uncertainty about R&D implementation. Please refer to the information disclosed by the company for specific progress.

On September 30, Dongxin Co., Ltd. announced the Investor Relations Activity Record Form. The planning cycle for the company's integrated chip R&D project is about 42 months, and the project is progressing in an orderly manner. The project integrates storage, connectivity, and computing units into a single chip through advanced packaging to create a low-power embedded intelligent computing chip. It has the characteristics of local intelligent processing, data privacy and security, low latency, and low power consumption. The company's own team is responsible for research and development. Chips need to go through various stages such as architecture design, streaming, software and hardware debugging, and customer verification. There is uncertainty about R&D implementation. Please refer to the information disclosed by the company for specific progress.