SK Hynix expanded the scale of storage semiconductor flip chip packaging outsourcing. Following OSAT supplier A-PROTECH, SK Hynix began outsourcing more business to WINPAC. This is another collaboration between the two companies after four years of cooperation. SK Hynix plans to hand over some DDR4 and DDR5 DRAM memory chip packaging orders to WinPac. Winpac has completed equipment commissioning and other production line preparations at the packaging plant in the P fence area, and has now entered the mass production stage. The perimeter is responsible for packaging high-performance products such as DRAM, NAND flash memory, and eUFS embedded general-purpose flash memory, and the monthly production capacity has increased from 44 million units to 50 million units.

SK Hynix expanded the scale of storage semiconductor flip chip packaging outsourcing. Following OSAT supplier A-PROTECH, SK Hynix began outsourcing more business to WINPAC. This is another collaboration between the two companies after four years of cooperation. SK Hynix plans to hand over some DDR4 and DDR5 DRAM memory chip packaging orders to WinPac. Winpac has completed equipment commissioning and other production line preparations at the packaging plant in the P fence area, and has now entered the mass production stage. The perimeter is responsible for packaging high-performance products such as DRAM, NAND flash memory, and eUFS embedded general-purpose flash memory, and the monthly production capacity has increased from 44 million units to 50 million units.