Delong Laser said on an interactive platform on September 28 that the company's silicon chip bonding equipment targets products of 1.6T and above used in optical modules. The technical threshold and yield are high, and small-batch orders have been received. The equipment accounts for a relatively small share of the company's overall revenue.

Zhitongcaijing · 2d ago
Delong Laser said on an interactive platform on September 28 that the company's silicon chip bonding equipment targets products of 1.6T and above used in optical modules. The technical threshold and yield are high, and small-batch orders have been received. The equipment accounts for a relatively small share of the company's overall revenue.