Some investors asked Steck that the pace of expansion of production in the HBM and Chiplet advanced packaging industry is accelerating. They want to inquire about the company's current orders for 3D-AOI and AXI testing equipment in the semiconductor direction, production schedules and capacity utilization for the third to fourth quarter; how is AXI equipment customer verification progressing; and whether future companies have plans to expand production capacity to meet the incremental demand for downstream sealing and testing equipment? On September 22, the company replied that the company's 3DSPI equipment, 3DAOI equipment, Sanko, etc. have all entered some leading domestic semiconductor packaging and testing customers and have been mass-produced and supplied.

Some investors asked Steck that the pace of expansion of production in the HBM and Chiplet advanced packaging industry is accelerating. They want to inquire about the company's current orders for 3D-AOI and AXI testing equipment in the semiconductor direction, production schedules and capacity utilization for the third to fourth quarter; how is AXI equipment customer verification progressing; and whether future companies have plans to expand production capacity to meet the incremental demand for downstream sealing and testing equipment? On September 22, the company replied that the company's 3DSPI equipment, 3DAOI equipment, Sanko, etc. have all entered some leading domestic semiconductor packaging and testing customers and have been mass-produced and supplied.