According to reports, the monthly production capacity of TSMC's 2nm process is expected to increase from 90,000 wafers at the end of this year to 110,000 wafers by the middle of next year, an increase of about 22%. The production capacity target for the 3nm process will increase from 120,000 to 130,000 wafers per month at the end of last year to 180,000 wafers by the end of this year, and reach 210,000 wafers by the middle of next year. If the plan is carried out as expected, the production capacity of the 3nm process will increase by about 70% from the end of 2025 to mid-2027. Additionally, TSMC is planning to build new 3nm wafer production facilities in Taiwan, Arizona, and Japan to increase production capacity, and convert some 5nm production lines to 3nm. As investment in advanced processes increases, next year's revenue is also expected to reach a record high.

According to reports, the monthly production capacity of TSMC's 2nm process is expected to increase from 90,000 wafers at the end of this year to 110,000 wafers by the middle of next year, an increase of about 22%. The production capacity target for the 3nm process will increase from 120,000 to 130,000 wafers per month at the end of last year to 180,000 wafers by the end of this year, and reach 210,000 wafers by the middle of next year. If the plan is carried out as expected, the production capacity of the 3nm process will increase by about 70% from the end of 2025 to mid-2027. Additionally, TSMC is planning to build new 3nm wafer production facilities in Taiwan, Arizona, and Japan to increase production capacity, and convert some 5nm production lines to 3nm. As investment in advanced processes increases, next year's revenue is also expected to reach a record high.