On September 14, at the 2026 semi-annual results meeting, Cheng Zhuo, chairman of Chipset, explained that the company's CO₂ laser drilling equipment was delivered in small batches in the first half of this year. Currently, it continues to promote verification and order conversion to leading customers in the PCB industry, improving the company's LDI exposure+laser drilling integrated equipment matrix. With customer verification and the gradual transformation of orders, equipment is expected to become a new addition to the PCB business. At the same time, the company said that, driven by demand for AI servers, high-speed optical modules, etc., the company has sufficient orders and production schedules for high-end PCB products. The production capacity of the Phase II base will be fully released in the second half of the year, and the first and second phases will operate collaboratively. The company will continue to ensure faster delivery of on-hand orders by expanding production and improving efficiency.

On September 14, at the 2026 semi-annual results meeting, Cheng Zhuo, chairman of Chipset, explained that the company's CO₂ laser drilling equipment was delivered in small batches in the first half of this year. Currently, it continues to promote verification and order conversion to leading customers in the PCB industry, improving the company's LDI exposure+laser drilling integrated equipment matrix. With customer verification and the gradual transformation of orders, equipment is expected to become a new addition to the PCB business. At the same time, the company said that, driven by demand for AI servers, high-speed optical modules, etc., the company has sufficient orders and production schedules for high-end PCB products. The production capacity of the Phase II base will be fully released in the second half of the year, and the first and second phases will operate collaboratively. The company will continue to ensure faster delivery of on-hand orders by expanding production and improving efficiency.