Shenzhen Technology announced that Peyton Technology, a wholly-owned subsidiary of the company, plans to further implement a high-end memory chip packaging and testing capacity expansion project. The total investment of the project is 1.85 billion yuan. First, it is planned to invest 1.22 billion yuan to establish a new wholly-owned subsidiary to build a new plant, which can carry 90,000 pieces/month of traditional packaging and 10,000 pieces/month of 2.5D advanced packaging; second, it is planned to invest 630 million yuan to build a 2.5D/3DS advanced packaging R&D line, which is expected to increase 2.5D/3DS advanced packaging production capacity by 100 pieces/month each after completion and delivery. The project is scheduled to be completed in December 2028.

Shenzhen Technology announced that Peyton Technology, a wholly-owned subsidiary of the company, plans to further implement a high-end memory chip packaging and testing capacity expansion project. The total investment of the project is 1.85 billion yuan. First, it is planned to invest 1.22 billion yuan to establish a new wholly-owned subsidiary to build a new plant, which can carry 90,000 pieces/month of traditional packaging and 10,000 pieces/month of 2.5D advanced packaging; second, it is planned to invest 630 million yuan to build a 2.5D/3DS advanced packaging R&D line, which is expected to increase 2.5D/3DS advanced packaging production capacity by 100 pieces/month each after completion and delivery. The project is scheduled to be completed in December 2028.