On September 7, Ningbo Qiushui Semiconductor Technology Co., Ltd. released a mass-produced 8-inch red micro-LED chip. This product uses non-destructive micro-LED chip technology developed by Qiusui Semiconductor, which can achieve 640 x 480 resolution red light display within 0.15 cubic centimeters, and is mainly aimed at near-eye display applications such as AR glasses. Red micro-LED is considered one of the technical difficulties of micro-LED to achieve full-color display. Traditional physical etching processes may damage light-emitting materials and affect luminescence efficiency. This time, Qiusui Semiconductor uses electrical insulation combined with a hybrid bonding vertical stack architecture to achieve pixel isolation. According to the company, the chip has a pixel yield of more than 99.9999% and can meet the requirements of automotive-grade temperature use. The relevant 8-inch hybrid bonding production line is scheduled to be put into operation in October this year, with a planned annual production capacity of 10 million chips.

On September 7, Ningbo Qiushui Semiconductor Technology Co., Ltd. released a mass-produced 8-inch red micro-LED chip. This product uses non-destructive micro-LED chip technology developed by Qiusui Semiconductor, which can achieve 640 x 480 resolution red light display within 0.15 cubic centimeters, and is mainly aimed at near-eye display applications such as AR glasses. Red micro-LED is considered one of the technical difficulties of micro-LED to achieve full-color display. Traditional physical etching processes may damage light-emitting materials and affect luminescence efficiency. This time, Qiusui Semiconductor uses electrical insulation combined with a hybrid bonding vertical stack architecture to achieve pixel isolation. According to the company, the chip has a pixel yield of more than 99.9999% and can meet the requirements of automotive-grade temperature use. The relevant 8-inch hybrid bonding production line is scheduled to be put into operation in October this year, with a planned annual production capacity of 10 million chips.