On August 31, it was reported that SK Hynix is collaborating with Intel to produce next-generation high-bandwidth memory component base chips. Intel may be introduced as early as the seventh-generation HBM product HBM4E to form a multi-vendor system with TSMC. SK Hynix previously produced its own substrate chips before the HBM3E, but as the logic function and performance requirements of base chips increased, it was transferred to TSMC's OEM starting with HBM4. Currently, the HBM4 base chips in mass production use TSMC's 12 nanometer process. According to industry insiders, the cost of the HBM4 base chip supplied by TSMC is about 3 to 4 times that of the core chip produced by SK Hynix's own 10-nanometer fifth-generation 1b process. With the HBM4E upgrade, cost pressure is expected to increase further. If Intel joins the supply chain, SK Hynix is expected to reduce costs and improve supply stability while reducing reliance on a single foundry.

On August 31, it was reported that SK Hynix is collaborating with Intel to produce next-generation high-bandwidth memory component base chips. Intel may be introduced as early as the seventh-generation HBM product HBM4E to form a multi-vendor system with TSMC. SK Hynix previously produced its own substrate chips before the HBM3E, but as the logic function and performance requirements of base chips increased, it was transferred to TSMC's OEM starting with HBM4. Currently, the HBM4 base chips in mass production use TSMC's 12 nanometer process. According to industry insiders, the cost of the HBM4 base chip supplied by TSMC is about 3 to 4 times that of the core chip produced by SK Hynix's own 10-nanometer fifth-generation 1b process. With the HBM4E upgrade, cost pressure is expected to increase further. If Intel joins the supply chain, SK Hynix is expected to reduce costs and improve supply stability while reducing reliance on a single foundry.