On August 28, SK Hynix announced that it held a groundbreaking ceremony for an advanced AI-oriented memory packaging production base at Purdue University in West Lafayette, Indiana, USA on the 27th local time. The Indiana fab, which will have a total investment of more than 4 billion US dollars, is expected to complete clean room construction in October 2028 and begin mass production of next-generation HBM in the second half of 2029. SK Hynix signed a memorandum of understanding with Purdue University on R&D cooperation in the field of advanced packaging at the groundbreaking ceremony. The two sides will strengthen R&D cooperation based on the MOU to jointly research next-generation system integration and advanced packaging technology, including HBM.

Zhitongcaijing · 2d ago
On August 28, SK Hynix announced that it held a groundbreaking ceremony for an advanced AI-oriented memory packaging production base at Purdue University in West Lafayette, Indiana, USA on the 27th local time. The Indiana fab, which will have a total investment of more than 4 billion US dollars, is expected to complete clean room construction in October 2028 and begin mass production of next-generation HBM in the second half of 2029. SK Hynix signed a memorandum of understanding with Purdue University on R&D cooperation in the field of advanced packaging at the groundbreaking ceremony. The two sides will strengthen R&D cooperation based on the MOU to jointly research next-generation system integration and advanced packaging technology, including HBM.