Recently, Nvidia announced that the world's first 200g/LANE co-packaged optical Spectrum-X Ethernet switch system has been fully mass-produced; SK Hynix recently released the next-generation AI optical interconnection CPO technology roadmap. Industry insiders believe that as CPO switches are implemented on a large scale and OCS all-optical switch technology continues to advance, the value distribution of the optical interconnection industry chain will usher in a restructuring, and upstream materials such as indium phosphide, thin-film lithium niobate, and silicon SOI wafers will usher in strong demand and development opportunities. The reporter noticed that currently, listed optical module companies are extending their business layout to upstream materials; listed material companies are laying out electronic materials fields such as indium phosphide and red phosphorus, and are being re-valued by the market.

Recently, Nvidia announced that the world's first 200g/LANE co-packaged optical Spectrum-X Ethernet switch system has been fully mass-produced; SK Hynix recently released the next-generation AI optical interconnection CPO technology roadmap. Industry insiders believe that as CPO switches are implemented on a large scale and OCS all-optical switch technology continues to advance, the value distribution of the optical interconnection industry chain will usher in a restructuring, and upstream materials such as indium phosphide, thin-film lithium niobate, and silicon SOI wafers will usher in strong demand and development opportunities. The reporter noticed that currently, listed optical module companies are extending their business layout to upstream materials; listed material companies are laying out electronic materials fields such as indium phosphide and red phosphorus, and are being re-valued by the market.