Dir Laser said in an institutional conference call on August 19 that TGV-related applications currently mainly include advanced packaging glass substrate holes, FAU, and optical communication glass passive devices. Glass substrates have advantages in surface flatness, thermal expansion matching, and high-frequency signal transmission, and are expected to be used in advanced packaging, RDL, CPO, new displays, RF devices, and power devices in the future. Judging from industry progress, the company's TGV equipment has covered wafer-level and panel-level applications, and continues to cooperate with customers in different regions and types. Customers already need to repurchase glass substrates. Overall, TGV and its derivative applications are still in the industrial introduction stage, but customer attention and market activity are high.

Dir Laser said in an institutional conference call on August 19 that TGV-related applications currently mainly include advanced packaging glass substrate holes, FAU, and optical communication glass passive devices. Glass substrates have advantages in surface flatness, thermal expansion matching, and high-frequency signal transmission, and are expected to be used in advanced packaging, RDL, CPO, new displays, RF devices, and power devices in the future. Judging from industry progress, the company's TGV equipment has covered wafer-level and panel-level applications, and continues to cooperate with customers in different regions and types. Customers already need to repurchase glass substrates. Overall, TGV and its derivative applications are still in the industrial introduction stage, but customer attention and market activity are high.