According to the CICC Research Report, the power consumption of global AI computing power chips is rapidly breaking through the limit of air cooling and cooling. Data centers are evolving to liquid cooling architectures, and it is expected that server liquid cooling pumps are expected to usher in a release cycle as the core power component. Domestic automotive thermal management leaders have demonstrated competitive advantages by relying on underlying processes such as precision electronic motor control and high voltage full sealing to enter the market.

According to the CICC Research Report, the power consumption of global AI computing power chips is rapidly breaking through the limit of air cooling and cooling. Data centers are evolving to liquid cooling architectures, and it is expected that server liquid cooling pumps are expected to usher in a release cycle as the core power component. Domestic automotive thermal management leaders have demonstrated competitive advantages by relying on underlying processes such as precision electronic motor control and high voltage full sealing to enter the market.