According to Yingxin Development's announcement, the company plans to issue shares to specific targets and raise no more than 1,779 million yuan. After deducting issuance fees, 1,053 million yuan will be used for advanced packaging and storage module manufacturing projects, 206 million yuan for memory master control chip research and development projects, and 520 million yuan to supplement working capital and repay bank loans. The first two projects were implemented by Changxing Semiconductor, a holding subsidiary of the company, and the company plans to proceed by providing them with loans. Before the capital raised is in place, the company can first invest with self-raised capital according to the project progress, and then replace it according to regulations. If the actual net amount of capital raised is less than the amount to be used, the shortfall will be solved by the company itself.

According to Yingxin Development's announcement, the company plans to issue shares to specific targets and raise no more than 1,779 million yuan. After deducting issuance fees, 1,053 million yuan will be used for advanced packaging and storage module manufacturing projects, 206 million yuan for memory master control chip research and development projects, and 520 million yuan to supplement working capital and repay bank loans. The first two projects were implemented by Changxing Semiconductor, a holding subsidiary of the company, and the company plans to proceed by providing them with loans. Before the capital raised is in place, the company can first invest with self-raised capital according to the project progress, and then replace it according to regulations. If the actual net amount of capital raised is less than the amount to be used, the shortfall will be solved by the company itself.