According to two people with direct knowledge of the project, TSMC is developing an advanced chip packaging technology similar to Intel's existing technology. This shows that the world's leading chipmaker is concerned about challenges from long-distance competitors. Chip packaging is the final stage of chip production. At this stage, individual silicon wafers are assembled into a single unit and connected together so that they can work as a whole and connect to the rest of the computer.

According to two people with direct knowledge of the project, TSMC is developing an advanced chip packaging technology similar to Intel's existing technology. This shows that the world's leading chipmaker is concerned about challenges from long-distance competitors. Chip packaging is the final stage of chip production. At this stage, individual silicon wafers are assembled into a single unit and connected together so that they can work as a whole and connect to the rest of the computer.