Semiconductor packaging and testing equipment manufacturer Hongteng has benefited from the upcoming release of Nvidia's next-generation AI chip, Rubin, and demand for the post-CoWOS process continues to heat up. Orders are already rising until next year. To resolve concerns about insufficient production capacity, the company has leased a new plant. It is expected to enter operation in August, and the overall assembly space will double. Hongteng supplies Nvidia's next-generation thermostat equipment, which cuts into the OS section of the sealing and testing factory, covering processes such as dispensing, implantation, pressing, and homogenizer bonding. In addition to graphene materials, it can also be used on indium sheets. At the same time, automatic optical inspection equipment also continues to be delivered and shipped to major sealing and testing manufacturers.

Semiconductor packaging and testing equipment manufacturer Hongteng has benefited from the upcoming release of Nvidia's next-generation AI chip, Rubin, and demand for the post-CoWOS process continues to heat up. Orders are already rising until next year. To resolve concerns about insufficient production capacity, the company has leased a new plant. It is expected to enter operation in August, and the overall assembly space will double. Hongteng supplies Nvidia's next-generation thermostat equipment, which cuts into the OS section of the sealing and testing factory, covering processes such as dispensing, implantation, pressing, and homogenizer bonding. In addition to graphene materials, it can also be used on indium sheets. At the same time, automatic optical inspection equipment also continues to be delivered and shipped to major sealing and testing manufacturers.