Lansi Technology announced that its wholly-owned subsidiary Lansi International Co., Ltd. recently signed a memorandum of cooperation with Intel Corporation. The memorandum mainly discusses cooperation intentions and preliminary arrangements between the two sides in the field of advanced glass through-hole packaging, including key processes such as glass substrate perforation molding, high-precision laser processing, metallized through hole deposition, and multi-layer interconnect wiring. The parties will discuss and evaluate potential collaborations, and Intel will provide relevant architectural information, manufacturability design guidelines, benchmark testing methods, and verification methods. The memorandum is valid for one year from the date it is signed by the authorized representatives of both parties, and can be extended through negotiations before the expiration date.

Lansi Technology announced that its wholly-owned subsidiary Lansi International Co., Ltd. recently signed a memorandum of cooperation with Intel Corporation. The memorandum mainly discusses cooperation intentions and preliminary arrangements between the two sides in the field of advanced glass through-hole packaging, including key processes such as glass substrate perforation molding, high-precision laser processing, metallized through hole deposition, and multi-layer interconnect wiring. The parties will discuss and evaluate potential collaborations, and Intel will provide relevant architectural information, manufacturability design guidelines, benchmark testing methods, and verification methods. The memorandum is valid for one year from the date it is signed by the authorized representatives of both parties, and can be extended through negotiations before the expiration date.