The advanced packaging concept fluctuated and rebounded, and Guangli Technology, Tongfu Microelectronics, Chipboard Microelectronics, Shenzhen Technology, Huatian Technology, and Ningbo Silicon Electronics followed suit.

Zhitongcaijing · 4d ago
The advanced packaging concept fluctuated and rebounded, and Guangli Technology, Tongfu Microelectronics, Chipboard Microelectronics, Shenzhen Technology, Huatian Technology, and Ningbo Silicon Electronics followed suit.