Hi Sun Technology establishes RMB 170 million asset-backed securities issuance phase 2

PUBT · 3d ago
Hi Sun Technology establishes RMB 170 million asset-backed securities issuance phase 2
  • Hi Sun Technology established RMB 170 million of asset-backed securities under its Ronghui Zhida-Xingyue No. 2 ABS Scheme, Phase 2.
  • Priority tranche set at RMB 161 million, AAA(sf) rating, 2.2% coupon, expected maturity June 30, 2027; to trade on Shanghai Stock Exchange.
  • Subordinated tranche set at RMB 9 million, unrated, expected maturity June 30, 2027; issued to Ronghui Zhida Factoring or affiliates.
  • Proceeds earmarked for general working capital in the group’s fintech services business.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hi Sun Technology (China) Limited published the original content used to generate this news brief via IIS, the regulatory disclosure system operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260722-12252694), on July 22, 2026, and is solely responsible for the information contained therein.