K-ASIC emphasized in the recently released “US Semiconductor Industry Trends in the First Half of 2026” report: “The semiconductor industry's competitive focus has shifted from individual chip performance to AI infrastructure.” K-ASIC is a Korean system semiconductor industry support base established in San Jose, California in September 2024 under the leadership of the Ministry of Industry, Trade and Resources of Korea. Based on the analysis of the first half of the year, K-ASIC stated that “semiconductor waferless manufacturers such as Nvidia, AMD, and Broadcom are surpassing GPUs and customized semiconductors to compete for integrated system platforms,” and “hyperscale companies such as Google, Amazon, Meta, and Microsoft are working to build vertically integrated AI platforms that include self-developed chips, data centers, and power assets.” In other words, competition has moved from “how fast and how many operations can AI semiconductor chips perform” to a pattern of “pre-emptively seizing the entire AI infrastructure such as memory, electricity, networks, and data centers.” According to K-ASIC's assessment, there are three major bottlenecks in AI infrastructure construction, namely: electricity — determining the upper limit of AI data center expansion; optical communication — connecting tens of thousands of AI semiconductor accelerators; and quantum computing — is emerging as a next-generation computing paradigm.

Zhitongcaijing · 2d ago
K-ASIC emphasized in the recently released “US Semiconductor Industry Trends in the First Half of 2026” report: “The semiconductor industry's competitive focus has shifted from individual chip performance to AI infrastructure.” K-ASIC is a Korean system semiconductor industry support base established in San Jose, California in September 2024 under the leadership of the Ministry of Industry, Trade and Resources of Korea. Based on the analysis of the first half of the year, K-ASIC stated that “semiconductor waferless manufacturers such as Nvidia, AMD, and Broadcom are surpassing GPUs and customized semiconductors to compete for integrated system platforms,” and “hyperscale companies such as Google, Amazon, Meta, and Microsoft are working to build vertically integrated AI platforms that include self-developed chips, data centers, and power assets.” In other words, competition has moved from “how fast and how many operations can AI semiconductor chips perform” to a pattern of “pre-emptively seizing the entire AI infrastructure such as memory, electricity, networks, and data centers.” According to K-ASIC's assessment, there are three major bottlenecks in AI infrastructure construction, namely: electricity — determining the upper limit of AI data center expansion; optical communication — connecting tens of thousands of AI semiconductor accelerators; and quantum computing — is emerging as a next-generation computing paradigm.