Guangpu Co., Ltd. announced that the company held a board of directors meeting on July 17, 2026 and agreed to extend the date for the “photoelectric sensor device integrated sealing and testing R&D and industrialization project” from July 25, 2026 to June 30, 2028, on the premise that the subject, use and scale of the fund-raising project remain the same. The total investment of the project was RMB 184.648,600. As of June 30, 2026, the amount of funds to be raised was RMB 15.3651 million. The delay is due to process technology iterations, etc., and will not have a significant adverse impact on production and operation.

Guangpu Co., Ltd. announced that the company held a board of directors meeting on July 17, 2026 and agreed to extend the date for the “photoelectric sensor device integrated sealing and testing R&D and industrialization project” from July 25, 2026 to June 30, 2028, on the premise that the subject, use and scale of the fund-raising project remain the same. The total investment of the project was RMB 184.648,600. As of June 30, 2026, the amount of funds to be raised was RMB 15.3651 million. The delay is due to process technology iterations, etc., and will not have a significant adverse impact on production and operation.