Zhanxin Co., Ltd. (301707.SZ), a company focusing on high-reliability analog chips and micromodule products, plans to publicly issue 41.12 million shares

Zhitong Finance App News, Zhanxin Co., Ltd. (301707.SZ) disclosed a prospectus of intent. The company plans to publicly issue 41.12 million shares, accounting for 10% of the total share capital after issuance. The initial number of strategic placements issued in this offering was 12.336 million shares, accounting for 30% of the number issued. The initial inquiry date for this offering is July 21, 2026, and the subscription date is July 27, 2026.

The company focuses on R&D, design, testing and sales of high-reliability analog chips and micromodule products. Among them, analog chip products are mainly power management chips, and segmented products include DC/DC conversion chips, linear voltage regulators (LDO), load and current limit switches (Load Switch), etc.; micromodule products can achieve various functions such as isolated and non-isolated DC/DC conversion, logic control, signal modulation, and diode control; at the same time, the company also provides discrete device products to customers. In addition, the company has also continued to expand its product line and extend its product matrix to signal chain chips. At present, it has initially completed the research and development of various products such as current detection chips, voltage reference chips, comparators, operational amplifiers, and timing chips.

The company's net profit from 2023 to 2025 was 179 million yuan, 95.3543 million yuan, and 228 million yuan, respectively. From January to June 2026, the company expects to achieve operating income of 317 million yuan to 347 million yuan, a year-on-year change of -6.79% to 2.09%; it is expected to achieve net profit attributable to owners of the parent company of 127 million yuan to 143 million yuan, an increase of 1.85% to 15.22% year on year; net profit attributable to owners of the parent company after deducting non-recurring profit and loss is expected to be 124 million yuan to 141 million yuan, an increase of 0.81% to 14.31% year on year.

After deducting costs such as issuance, the actual capital raised in this release is to invest 425 million yuan in R&D and industrialization projects for high-reliability power management chips and signal chain chips, 183 million yuan for headquarters base and R&D center construction projects, 161 million yuan for test center construction projects, and 120 million yuan to supplement working capital. A total of 890 million yuan is to be invested to raise capital.