BofA Keeps BE Semiconductor at Buy on Hybrid Bonding Strength, AI Focus

MT Newswires · 5d ago
03:33 AM EST, 01/07/2026 (MT Newswires) -- BofA Global Research affirmed BE Semiconductor Industries' (BESI.AS) buy rating, with a price objective of 189 euros, citing its "dominant" market share in hybrid bonding. "We believe hybrid bonding orders are set to finally accelerate, with increasing adoption cases in GPUs (AMD), ASICs, CPOs and HBM," analysts said Tuesday. "TSMC AP7 advanced packaging fab is ramping with phase 1 equipment move-in expected in 2026E and phase 2 recently beginning equipment installation and testing. We also expect strong China demand as chipmakers there are using Besi's bonding tools to stack chips to overcome shrink limitations." The research firm forecasts a 40% compound annual growth rate for the Dutch semiconductor equipment maker's sales from 2024 to 2027, the highest in BofA's coverage, with artificial intelligence accounting for 50% of revenue going forward. "As valuation premiums increasingly align with measurable AI revenue contribution, underappreciated names ([ASM International (ASM.AS), Infineon Technologies (IFX.F)], BESI) could see catch-up rerating in 26E," analysts added.