According to the CITIC Securities Research Report, high-end PCB functional wet electronic chemicals are the intersection of AI-driven process upgrading and domestic substitution. In the hole metallization and electroplating process, which occupies the core of value, the localization rate is still low, and there is clear room for import substitution. Demand for AI servers and advanced packaging will push the industry into a new stage of “sharp rise in quantity and quality.”

According to the CITIC Securities Research Report, high-end PCB functional wet electronic chemicals are the intersection of AI-driven process upgrading and domestic substitution. In the hole metallization and electroplating process, which occupies the core of value, the localization rate is still low, and there is clear room for import substitution. Demand for AI servers and advanced packaging will push the industry into a new stage of “sharp rise in quantity and quality.”