Dir Laser said on an interactive platform on December 4 that the company's TGV equipment used in semiconductor chip packaging, display chip packaging and other fields has completed the shipment of panel-level glass substrate through-hole equipment, achieving full coverage of wafer-level and panel-level TGV packaging laser technology. The company's ultra-fast laser drilling technology for the PCB industry is currently being developed, and continues to promote the extension of technology and application expansion. Currently, prototypes of ultra-fast laser drilling equipment are being tested.

Dir Laser said on an interactive platform on December 4 that the company's TGV equipment used in semiconductor chip packaging, display chip packaging and other fields has completed the shipment of panel-level glass substrate through-hole equipment, achieving full coverage of wafer-level and panel-level TGV packaging laser technology. The company's ultra-fast laser drilling technology for the PCB industry is currently being developed, and continues to promote the extension of technology and application expansion. Currently, prototypes of ultra-fast laser drilling equipment are being tested.