Building a new growth point, Yidong Electronics (301123.SZ) plans to acquire a 51% stake in liquid cooling company Shenzhen Guanding for 61.2 million yuan

Zhitong Finance App News, Yidong Electronics (301123.SZ) announced that the company plans to invest 61.2 million yuan in Shenzhen Guanding Metal Technology Co., Ltd. (“Shenzhen Guanding”) and eventually acquire 51.00% of Shenzhen Guanding's shares. The subsidiary Dongguan Kelixing Electronics Co., Ltd. (“Kelixing” for short) increased its capital by 2,222.22 million yuan, and the original actual controller of Shenzhen Guanding or its designated third party invested 30 million yuan to subscribe. Shenzhen Guanding is a comprehensive solution provider focusing on AI computing power and liquid cooling product structure. It has become a core supplier for leading customers in the field of liquid cooling and cooling.

According to reports, the target company has an experienced R&D team in the field of heat dissipation, which is dedicated to the development of electronic cooling products. The main products include water cooling plates, immersion cooling modules, water cooling modules, PC cooling modules, shovel tooth radiators, friction welding cold plates, heat pipe heat transfer heat dissipation modules, condensing radiators, VC cooling, etc. The products are widely used in AI servers, graphics cards (GPUs), supercomputing centers, data centers, cloud computing, aerospace, computing power electronics, energy storage, new energy, lasers, etc. The target company has complete thermal management R&D, design and production processes, such as brazing (vacuum, tunnel, high frequency, flame, etc.) and welding processes such as friction welding, argon arc welding, laser welding, etc., as well as capabilities in mold development, CNC, CNC bending, pipe pressure, and surface treatment.

According to the announcement, through this merger and acquisition of enterprises with core R&D capabilities in the field of liquid cooling technology, the company has obtained mature liquid cooling product technology and patent reserves. Integration with the company's existing technology development and engineering process system can reduce the independent R&D cycle, quickly seize the high position of liquid cooling technology, adapt to the high-power cooling requirements of computing power equipment and AI terminals, and create an integrated solution for the company's AI computing power liquid cooling and cooling system. Achieve the company's strategic leap forward in “connector+liquid cooling” and “precision electronics+liquid cooling”, and build a new business growth point for the company in the AI computing power era.