In order to improve performance, Nvidia plans to replace the intermediate substrate material for the CoWOS advanced packaging process from silicon to silicon carbide in the development blueprint for next-generation Rubin processors. Currently, TSMC is inviting major manufacturers to jointly develop manufacturing technology for silicon carbide intermediate substrates, and Nvidia's first-generation Rubin GPUs will still use silicon intermediate substrates. However, since Nvidia's requirements for improved performance are extremely high, when the heat generated within the chip exceeds the limit, silicon carbide must be used. By 2027, silicon carbide will enter advanced packaging.

In order to improve performance, Nvidia plans to replace the intermediate substrate material for the CoWOS advanced packaging process from silicon to silicon carbide in the development blueprint for next-generation Rubin processors. Currently, TSMC is inviting major manufacturers to jointly develop manufacturing technology for silicon carbide intermediate substrates, and Nvidia's first-generation Rubin GPUs will still use silicon intermediate substrates. However, since Nvidia's requirements for improved performance are extremely high, when the heat generated within the chip exceeds the limit, silicon carbide must be used. By 2027, silicon carbide will enter advanced packaging.