Recently, at the 2025 Shenzhen International Electronics Show and Embedded Exhibition, Kangying Semiconductor released the upgraded version of the ePOP embedded memory chip, the upgraded version of the Smallpkg.emMC embedded memory chip, and PCIe5.0 solid-state drives, which are suitable for AI terminal product applications such as AI glasses to support AI computing power scenarios. According to reports, the KowinePop embedded memory chip integrates eMMC and LPDDR, with a minimum thickness of only 0.75mm, and is now widely used in smart wearable devices and other products.

Zhitongcaijing · 08/28/2025 02:25
Recently, at the 2025 Shenzhen International Electronics Show and Embedded Exhibition, Kangying Semiconductor released the upgraded version of the ePOP embedded memory chip, the upgraded version of the Smallpkg.emMC embedded memory chip, and PCIe5.0 solid-state drives, which are suitable for AI terminal product applications such as AI glasses to support AI computing power scenarios. According to reports, the KowinePop embedded memory chip integrates eMMC and LPDDR, with a minimum thickness of only 0.75mm, and is now widely used in smart wearable devices and other products.