Micron Technology announced that the HBM3E 12-layer stack 36GB memory was introduced into AMD's latest MI350 series, adding another major customer after entering Nvidia. Micron emphasized that this collaboration highlights the key role of energy efficiency and efficiency in training large-scale AI models, providing high-throughput inference, and handling complex high-efficiency computational workloads, such as data processing and computational modeling, and is another major milestone in Micron's leadership in the HBM industry.

Micron Technology announced that the HBM3E 12-layer stack 36GB memory was introduced into AMD's latest MI350 series, adding another major customer after entering Nvidia. Micron emphasized that this collaboration highlights the key role of energy efficiency and efficiency in training large-scale AI models, providing high-throughput inference, and handling complex high-efficiency computational workloads, such as data processing and computational modeling, and is another major milestone in Micron's leadership in the HBM industry.