On October 16, the 2024 Bay Area Semiconductor Industry Ecological Expo hosted by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance (Shenzhen Semiconductor Alliance) opened in Shenzhen, Guangdong Province. At the opening ceremony and summit forum, Shenzhen Xinmeng led 9 representative organizations to jointly sign an ecological co-construction proposal, advocating the “four insistence” for promoting industrial development: adhering to open cooperation, adhering to market orientation, adhering to innovation drive, and adhering to integrated development. The nine representative organizations that have jointly signed the Ecological Co-Construction Proposal include: Beijing North Huachuang Microelectronics Equipment Co., Ltd., Shenzhen Innovation Investment Group Co., Ltd., Yuexin Semiconductor, China Integrated Circuit Innovation Alliance, Shenzhen Major Industry Investment Group Co., Ltd., Fudan University School of Microelectronics, Aifak Trading Co., Ltd., Ningbo Jiangfeng Electronic Materials Co., Ltd., and Shenzhen Pinghu Laboratory National Third-Generation Semiconductor Technology Innovation Center.

On October 16, the 2024 Bay Area Semiconductor Industry Ecological Expo hosted by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance (Shenzhen Semiconductor Alliance) opened in Shenzhen, Guangdong Province. At the opening ceremony and summit forum, Shenzhen Xinmeng led 9 representative organizations to jointly sign an ecological co-construction proposal, advocating the “four insistence” for promoting industrial development: adhering to open cooperation, adhering to market orientation, adhering to innovation drive, and adhering to integrated development. The nine representative organizations that have jointly signed the Ecological Co-Construction Proposal include: Beijing North Huachuang Microelectronics Equipment Co., Ltd., Shenzhen Innovation Investment Group Co., Ltd., Yuexin Semiconductor, China Integrated Circuit Innovation Alliance, Shenzhen Major Industry Investment Group Co., Ltd., Fudan University School of Microelectronics, Aifak Trading Co., Ltd., Ningbo Jiangfeng Electronic Materials Co., Ltd., and Shenzhen Pinghu Laboratory National Third-Generation Semiconductor Technology Innovation Center.