Some investors asked Dier Laser. What is the progress of the company's TGV laser microporous equipment orders and proofing tests so far? Dir Laser said on the interactive platform that at present, the company has completed the shipment of panel-level glass substrate through-hole equipment, achieving full coverage of wafer-level and panel-level TGV packaging laser technology.

Zhitongcaijing · 10/15 10:09
Some investors asked Dier Laser. What is the progress of the company's TGV laser microporous equipment orders and proofing tests so far? Dir Laser said on the interactive platform that at present, the company has completed the shipment of panel-level glass substrate through-hole equipment, achieving full coverage of wafer-level and panel-level TGV packaging laser technology.