Flex And JetCool Partner To Develop Liquid Cooling-Ready Servers For AI And High-Density Workloads

Benzinga · 10/14 13:02

JetCool, a leading liquid cooling company for data centers, and Flex (NASDAQ:FLEX) today announced a partnership to address the growing demand for AI servers and high-density compute from hyperscalers and enterprise customers. The companies are building rack-level solutions, including a new line of co-designed liquid cooling-ready servers that are compliant with Open Compute Project (OCP) specification.

The new servers leverage JetCool's patented microconvective liquid cooling technology that uses precision jets to target and cool processor hot spots. This precision cooling manages the increased heat from high-performance AI and compute workloads, ensuring optimal performance and reliability. Additionally, these liquid-cooled servers provide a versatile platform for hyperscalers to design customized AI chip architectures and tailored server configurations to meet unique performance requirements.

JetCool is also launching a 6U in-rack Coolant Distribution Unit (CDU) that is capable of cooling 300kW and scalable to 2.1MW at a row level. At the 2024 OCP Global Summit, JetCool will also demonstrate its fully-sealed SmartPlate cold plate, which cools superchips over 3kW, showcasing the significant headroom potential for single-phase direct-to-chip liquid cooling for high-performance applications, using sustainable non-toxic fluids.