MARKET

AMKR

AMKR

Amkor Tech
NASDAQ
37.94
-0.24
-0.63%
Opening 09:41 07/26 EDT
OPEN
39.05
PREV CLOSE
38.18
HIGH
39.15
LOW
37.92
VOLUME
72.70K
TURNOVER
0
52 WEEK HIGH
44.86
52 WEEK LOW
17.45
MARKET CAP
9.34B
P/E (TTM)
25.13
1D
5D
1M
3M
1Y
5Y
1D
Amkor signs preliminary terms for up to $400M in CHIPS Act funding
Seeking Alpha · 15h ago
AMKOR TECHNOLOGY: PLANS TO TAKE ADVANTAGE OF DEPARTMENT OF TREASURY'S INVESTMENT TAX CREDIT
Reuters · 16h ago
US to award Amkor up to $400 million for chip packaging plant
US to award Amkor Technology up to $400 million for chip packaging plant in Arizona. The plant is set to be the largest of its kind in the U.S. And will package and test millions of chips for autonomous vehicles. Apple will be its first and biggest customer.
Reuters · 16h ago
Amkor Signs Preliminary Memorandum of Terms with US Department of Commerce for Arizona Advanced Packaging and Test Facility
Barchart · 21h ago
Does Amkor Technology (NASDAQ:AMKR) Have A Healthy Balance Sheet?
Amkor Technology, Inc. Has US$1.15b of debt on its balance sheet. But the company has a strong balance sheet, with net cash of US$421.4m. The company's debt load may be a concern, but it does not pose a major risk to investors. The balance sheet is a good indicator of a company's ability to pay off debt. Amkor technology has a high level of debt, but also has plenty of cash and liquid assets. Future earnings will determine whether the company can pay off its debt.
Simply Wall St · 2d ago
Advanced Micro Devices (AMD) Earnings Expected to Grow: What to Know Ahead of Next Week's Release
NASDAQ · 3d ago
Amkor Technology Reaches Analyst Target Price
NASDAQ · 3d ago
Weekly Report: what happened at AMKR last week (0715-0719)?
Weekly Report · 4d ago
More
About AMKR
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.

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