MARKET

AMKR

AMKR

Amkor Tech
NASDAQ
27.30
-0.45
-1.62%
Closed 15:05 11/25 EST
OPEN
27.55
PREV CLOSE
27.75
HIGH
27.69
LOW
27.28
VOLUME
517.40K
TURNOVER
0
52 WEEK HIGH
29.10
52 WEEK LOW
14.85
MARKET CAP
6.69B
P/E (TTM)
8.21
1D
5D
1M
3M
1Y
5Y
Insider Sell: Amkor Technology
Insider Sell: Amkor Technology
MT Newswires · 6d ago
BRIEF-Amkor Announces 50% Increase In Quarterly Cash Dividend And Shareholder Return Goal
Reuters · 11/15 22:15
Amkor Technology to Participate at Upcoming Conferences
TEMPE, Ariz., November 14, 2022--Amkor Technology to Participate at Upcoming Conferences
Business Wire · 11/14 18:35
Amkor Technology Third Quarter 2022 Earnings: Beats Expectations
Amkor Technology ( NASDAQ:AMKR ) Third Quarter 2022 Results Key Financial Results Revenue: US$2.08b (up 24% from 3Q...
Simply Wall St. · 11/09 10:23
Research Alert: CFRA Maintains Buy Opinion On Shares Of Amkor Technology, Inc.
Research Alert: CFRA Maintains Buy Opinion On Shares Of Amkor Technology, Inc.
MT Newswires · 11/01 11:32
BRIEF-Amkor Technology Reports Financial Results For Q3 2022
Reuters · 10/31 21:49
Amkor Technology GAAP EPS of $1.24, revenue of $2.08B
Seekingalpha · 10/31 20:10
Amkor Technology Sees Q4 Sales $1.80B-$1.90B Vs $1.87B Est.
Benzinga · 10/31 20:07
More
About AMKR
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip-specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. It refers to its flip chip, wafer-level processing and related test services as Advanced Products, and its wirebond packaging, power device packaging and related test services as Mainstream Products. Its Advanced Products include flip chip scale packages, wafer-level packages, and flip chip ball grid array (FCBGA) packages. Its Mainstream Products include leadframe packages, substrate-based wirebond packages, and micro-electro-mechanical systems (MEMS) packages.

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