News
ACMR
79.41
+1.13%
0.89
Weekly Report: what happened at ACMR last week (0810-0814)?
Weekly Report · 4d ago
Noteworthy Friday Option Activity: ACMR, COIN, AAPL
NASDAQ · 08/14 19:21
Here’s How Much You Would Have Made Owning ACM Research Stock In The Last 5 Years
Benzinga · 08/13 23:15
ACM Research Earnings Call Signals Broad-Based Growth
TipRanks · 08/12 00:28
Pricey but popular: Top technology stocks with high momentum, weak valuation
Seeking Alpha · 08/10 18:48
ACMR Q2 Earnings Surpass Estimates, Revenues Rise Y/Y
NASDAQ · 08/10 15:09
ACM Research price target raised to $100 from $81 at Craig-Hallum
TipRanks · 08/10 12:50
Analysts Conflicted on These Technology Names: AvePoint (AVPT) and ACM Research (ACMR)
TipRanks · 08/10 10:50
Weekly Report: what happened at ACMR last week (0803-0807)?
Weekly Report · 08/10 09:19
At a glance: stocks gapping up premarket
Seeking Alpha · 08/07 11:25
ACM Research, Inc. (ACMR) Q2 Earnings and Revenues Surpass Estimates
NASDAQ · 08/07 11:10
ACM Research Shares Gain on Narrowed Outlook, Rising Demand
Dow Jones · 08/07 10:41
ACM Research, Inc. Bottom Line Rises In Q2
NASDAQ · 08/07 09:36
ACM Research Raises FY2026 Sales Guidance from $1.080B-$1.175B to $1.125B-$1.175B vs $1.158B Est
Benzinga · 08/07 09:28
ACM Research beats top-line and bottom-line estimates; raises FY26 outlook
Seeking Alpha · 08/07 09:13
ACM Research reports Q2 EPS 61c, consensus 34c
TipRanks · 08/07 09:10
ACM Research narrows FY26 revenue view to $1.13B-$1.18B from $1.08B-$1.18B
TipRanks · 08/07 09:10
*ACM Research 2Q EPS $1.23 >ACMR
Dow Jones · 08/07 09:00
*ACM Research 2Q Adj EPS 61c >ACMR
Dow Jones · 08/07 09:00
*ACM Research 2Q Net $89M >ACMR
Dow Jones · 08/07 09:00
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About ACMR
ACM Research, Inc. develops, manufactures and sells semiconductor process equipment spanning cleaning, electroplating, stress-free polishing, vertical furnace processes, track, plasma-enhanced chemical vapor deposition (PECVD), and wafer- and panel-level packaging tools, enabling advanced and semi-critical semiconductor device manufacturing. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. It also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers. Its other advanced packaging tools include Ultra ECP ap, Ultra C Developer, and Ultra C PR Megasonic-Assisted Stripper.